Process Engineer Metallization/Vacuum Deposition

You are responsible for processes and systems for the deposition of thin metal layers using sputtering and evaporation in thin-film technology.

Tasks

• Responsibility for processes and systems for the deposition of thin metal layers (sputtering, evaporation)
• Ensuring stability and reproducibility of the deposition processes
• Development of new and improvement of existing processes
• Metrological assessment of layer properties
• Collaboration in the procurement and commissioning of new systems including documentation
• Planning and management of internal and customer projects
• Training of production employees

Profile

• Degree FH/University (Bachelor/Master) in microsystems technology, physics, engineering or comparable
• Alternatively technical training with several years of relevant professional experience
• Knowledge of vacuum technology and vacuum systems
• Hands-on experience with vacuum systems for layer deposition
• Knowledge of PVD (sputtering, evaporation)
• Knowledge of thin-film or semiconductor technology
• Good German and English skills in spoken and written form

Offer

• Workload 80-100%
• 3–6 months interim, then permanent employment

Company

Electronics manufacturing

Application: online via Try&Hire, with your profile — https://tryandhire.io/ch-de/einsaetze/e/prozessingenieur-metallisierung-vakuumabscheidung-tah-fsrf7/